In a groundbreaking move, Chinese tech giant Huawei has broken its silence to reveal a comprehensive product roadmap for its chips and computing power systems, marking its first public strategy to compete with global leader Nvidia. The announcement, made on September 18, 2024, outlines Huawei’s plans to introduce three new Ascend series chips over the next three years, starting with the Ascend 950 in the first quarter of 2025. The Ascend 950 will come in two variants: the 950PR, optimized for inference and recommendations, and the 950DT, designed for model training and decoding. Huawei also revealed that the Ascend 960 and 970 will significantly boost computing power and memory capacity, with the 970 expected to surpass Nvidia’s offerings. Despite U.S. export restrictions limiting Huawei’s access to TSMC, the company has developed its own high-bandwidth memory (HBM) technology, which it claims is more cost-effective than SK Hynix and Samsung’s HBM3E and HBM4E. Huawei’s cluster computing systems, such as the Atlas 900 A3 SuperPoD, already rival Nvidia’s advanced products, and the company plans to launch the Atlas 950 SuperPod in Q4 2026, boasting 6.7 times more computing power than Nvidia’s NVL144 system. Additionally, Huawei’s Kunpeng CPU chip series, first introduced in 2019, will see new iterations in 2026 and 2028, accompanied by the TaiShan 950 SuperPod for general-purpose computing. This bold strategy underscores Huawei’s determination to establish itself as a major player in the global semiconductor and AI markets.