Researchers at Shanghai’s Fudan University have achieved a groundbreaking advancement in electronic engineering by developing complex circuitry within ultra-thin, flexible fibers. This innovation, dubbed the “fiber chip” technology, represents a significant departure from conventional rigid silicon-based chips, enabling fabrics to possess computational capabilities while maintaining the softness and flexibility required for everyday clothing applications.
The research team overcame longstanding technical challenges by implementing a novel “multilayered spiral architecture” that utilizes the internal three-dimensional space of fibers rather than relying solely on surface area. This architectural breakthrough allows for unprecedented transistor density within microscopic fibers. Experimental results demonstrate that a mere 1-millimeter fiber segment can accommodate approximately 10,000 transistors, equivalent to the processing power of modern cardiac pacemakers. When extended to one meter, these fibers can potentially contain millions of transistors, rivaling the computational capacity of standard desktop computer processors.
This technological leap holds particular promise for healthcare applications, especially in brain-computer interface (BCI) systems. Current BCI technology relies on rigid electrodes connected to external computing devices through cumbersome wiring. The fiber chip enables the development of fully integrated “closed-loop” systems where sensing, data processing, and therapeutic stimulation occur within a single flexible fiber. Professor Peng Huisheng, co-author of the study published in Nature, emphasized that these fibers—measuring just 50 micrometers in diameter (thinner than human hair) and matching the flexibility of brain tissue—offer significantly improved safety and efficacy for neurological treatments.
Beyond healthcare, the technology promises to revolutionize virtual reality experiences through the development of imperceptibly thin tactile gloves that can accurately simulate texture and pressure sensations. Research team member Chen Peining confirmed that the manufacturing process demonstrates strong compatibility with existing chip fabrication infrastructure, indicating that mass production feasibility has already been established. This development marks a critical step toward truly seamless integration of computational capabilities into everyday textiles and medical devices.